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Chip Orientation and Defects Detection software.
Machine for chips testing contains source chip band,
several chip store areas, set of testing units and a robot,
which moves chips to testing units and store areas.
The robot takes a chip from the source band, paces it to one of testing units
and then to one of the storage areas depending on testing result.
The software provides means to determine chip position and angle so,
that the robot could place the chip properly on the testing unit.
Chip Orientation and Defects Detection algorithm based on taking digital
images of the chip placed on the special orientation pad and determining from
this image real chip center position and orientation angle. Additionally the software
detects visually bad chips (i.e. with wrong pins
number or position) and report them to the robot which will then take these chips
to designated storage area.
During normal operation robot takes a chip from source band and places it to
the orientation pad. The program takes image of the chip, determines chip position and
angle and checks if the chip is defective or not. This information transferred to
the robot which performs necessary actions.
Active Layer Thickness Control software
The product is long band of dark opaque active layer laminated on the
metal mesh screen. Production process consists of opaque film formation with
subsequent lamination the film to metal grating substrate band.
Purpose of the software is to measure active layer thickness and raise alarm
when coating thickness exits from predefined limits.
The method of the active layer thickness measurement based on illumination
of the measured film with 2 flat laser beams from 2 sides of the film,
synchronously taking digital pictures of the film with 2 cameras and subsequent
images analysis. The measurement algorithm is robust to film vibration during
measurement.
Electrode Holes Detection software.
The product is long band of dark opaque active layer laminated on the
metal mesh screen. Purpose of the software is to detect holes in the active
layer and raise alarm when a through hole found in the electrode.
The method of the holes detection based on illumination of the electrode
from back side, taking digital pictures of the electrode with subsequent
image analysis.
Active Layer Surface Inspection software.
The product is long band of dark opaque active layer laminated on the
metal mesh screen.
Purpose of the software is to find active layer surface
defects and raise alarm when a defect discovered.
The method of the defects detection based on taking digital pictures of the film
with subsequent image analysis. The film lighted from the front side and
the picture taken also from the front side. Scratches are seen as patches
of different density from good coating background.
AVT Camera Benchmark software.
The program provides information of AVT camera performance as time required
to perform necessary operations. The program measures minimum, maximum and
average execution time for basic camera operations: gain setting, exposure
time setting, capture region setting, image capture at maximum region setting
and nominal exposure time, image capture at minimum region setting and nominal
exposure time. The program stores test results to text file.
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